The AMD “Sound Wave” APU has recently surfaced in shipping manifests, sparking renewed interest in what appears to be a long-rumored low-power processor from the company. According to leaked customs data shared by a reliable source, the APU is listed under the internal designation “SMV” and features a compact BGA-1074 package measuring 32 by 27 millimeters, making it well-suited for mobile and handheld applications due to its small size that aligns with typical mobile SoC standards. This package adopts the FF5 interface with a 0.8-millimeter pitch, representing an upgrade from older connectors like the FF3 used in devices such as the Valve Steam Deck, which could imply improved compatibility or efficiency in compact form factors.
Rumors surrounding the “Sound Wave” suggest it could mark AMD’s return to non-x86 architectures after more than a decade, potentially utilizing an ARM-based design to target energy-efficient Windows on ARM systems. Earlier leaks have speculated on its configuration, including two performance cores paired with four efficiency cores for a total of six cores, alongside integrated graphics based on four RDNA 3.5 compute units. The APU is positioned for low-power operation, aiming for under 10 watts, which positions it as a modest contender in the ARM ecosystem rather than a direct rival to high-end offerings like Qualcomm’s Snapdragon X2 Elite, which boasts up to 18 combined cores.
The leak originates from shipping manifest data uncovered by leaker @Olrak29_ and reported through sources like ITHome, confirming the chip’s development after a prolonged period of silence since the codename first emerged. Speculation points to a possible debut in 2026, potentially integrated into new Microsoft Surface hardware, where its low-power profile could enhance battery life and portability in ARM-based laptops or tablets. However, AMD has not officially announced the “Sound Wave” APU, and all details remain unconfirmed rumors, leaving room for adjustments in final specifications or target markets as development progresses.